TICEAS 2019

The International Conference on Engineering and Applied Sciences

February 12-15, 2019  Singapore

 

NewsImportant Reminder about Submission Deadline >>> October 17, 2018

Call for Papers Flyer Download

Technical tour - Singapore Institute of Management (SIM)

The International Conference on Engineering and Applied Sciences (TICEAS) is an international platform for scholars, researchers and practitioners to discuss interdisciplinary research and practices in the fields of Biomedical Engineering, Chemical Engineering, Civil Engineering, Computing Science & IT Engineering, Electrical & Electronic Engineering, Environmental Engineering, Fundamental and Applied Sciences, Material Science and Engineering, Mechanical Engineering and all sub-fields.

2019 TICEAS will take place from February 12-15 in Singapore. Prospective authors are invited to submit original research abstracts or full papers which were not, are not and have not been submitted/published/under consideration in other conferences and journals.

  

 Contact TICEAS Secretariat: ticeas@ticeas.org 

        

   

Important Dates

Sign Up and Submit

  • Submission Deadline

          October 17, 2018

  • Notification of Acceptance 

          From November 01, 2018

  • Early Bird Registration & Payment Deadline

          November 15, 2018

  • Standard Registration & Payment Deadline

           December 10, 2018

  • Late Registration Deadline

          January 14, 2019

  • Conference Date

          February 12-15, 2019

 

 

 

Contact & Inquiry

TICEAS Secretariat
Email: ticeas@ticeas.org

 

Line account: @highereducation 

we chat account: wxid_17n9o8qh4yzw22

 


Contact Us: ticeas@ticeas.org

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