TICEAS 2019

The International Conference on Engineering and Applied Sciences

February 12-15, 2019  Singapore

 

News Submission is STILL OPEN

Regular Registration Deadline---> December 13, 2018

SUBMISSION NOTICE:

Submit before 13 December 2018 --> will be collected in the conference program first version (announced on 26 December 2018)
Submit within 14-24 December 2018 -->will be collected in the conference program final version (announced on  January 14, 2019)

Technical tour - Singapore Institute of Management (SIM)

The International Conference on Engineering and Applied Sciences (TICEAS) is an international platform for scholars, researchers and practitioners to discuss interdisciplinary research and practices in the fields of Biomedical Engineering, Chemical Engineering, Civil Engineering, Computing Science & IT Engineering, Electrical & Electronic Engineering, Environmental Engineering, Fundamental and Applied Sciences, Material Science and Engineering, Mechanical Engineering and all sub-fields.

2019 TICEAS will take place from February 12-15 in Singapore. Prospective authors are invited to submit original research abstracts or full papers which were not, are not and have not been submitted/published/under consideration in other conferences and journals.

  

 Contact TICEAS Secretariat: ticeas@ticeas.org 

        

   

Important Dates

Sign Up and Submit

  • Submission Deadline

          October 17, 2018

          Still OPEN

  • Notification of Acceptance 

          From November 01, 2018

  • Standard Registration & Payment Deadline

           December 13, 2018

  • Late Registration Deadline

          January 14, 2019

  • Conference Date

          February 12-15, 2019

 

 

 

Contact & Inquiry

TICEAS Secretariat
Email: ticeas@ticeas.org


Contact Us: ticeas@ticeas.org

Copyright © The International Conference on Engineering and Applied Sciences (TICEAS). All rights reserved.