The International Conference on Engineering and Applied Sciences
February 12-15, 2019 Singapore
NewsImportant Reminder about Submission Deadline >>> October 17, 2018
Call for Papers Flyer Download
Technical tour - Singapore Institute of Management (SIM)
The International Conference on Engineering and Applied Sciences (TICEAS) is an international platform for scholars, researchers and practitioners to discuss interdisciplinary research and practices in the fields of Biomedical Engineering, Chemical Engineering, Civil Engineering, Computing Science & IT Engineering, Electrical & Electronic Engineering, Environmental Engineering, Fundamental and Applied Sciences, Material Science and Engineering, Mechanical Engineering and all sub-fields.
2019 TICEAS will take place from February 12-15 in Singapore. Prospective authors are invited to submit original research abstracts or full papers which were not, are not and have not been submitted/published/under consideration in other conferences and journals.
Contact TICEAS Secretariat: firstname.lastname@example.org